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- 8 Layers HDI
- Layers: 8L
- Min hole size: 0.15mm
- Minimum line width/space: 3/3mil
- Solder resist type: photosensitive ink
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Products Details
Key Specifications/Special Features:
Key specifications:
MOQ: 1pc
Layers: 8L
Material: FR-4
Surface: ENIG
Soldermask: green
PCB thickness: 1.6mm
Min hole size: 0.15mm
Minimum line width/space: 3/3mil
Impedance tolerance: ±10%
Solder resist type: photosensitive ink
Shipping Information:
FOB Port:Shenzhen
Lead Time:4 - 15 days
Dimensions per Unit:15 × 10 × 5 Centimeters
Weight per Unit:15 Kilograms
Units per Export Carton:500
Export Carton Dimensions L/W/H:33 × 23 × 20 Centimeters
Export Carton Weight:150 Grams
Main Export Markets:
Asia
Central/South America
Eastern Europe
